With this feeding technology, world class assembly solutions can be configured to support a wide variety of products, including:
• Hybrid Circuits and Sensors
• Multi-Chip Modules
• Semiconductor Components, including SIP
• RFID Tags
• 3-D Assemblies
• MEMS
• Solar Cell Assemblies
| Speed | Up to 5000 cph, flip chip * Up to 3500 cph, direct die * application dependant |
| Die Size | 0.7mm to 11.0mm * Down to 0.075mm - 4.0mm thickness * Dimensions above require application review |
| Wafer Size | 100 to 300mm diameter |
| Dimensions | Height: 1569mm Length: 1318mm Width: 127mm Weight: 45kg |
The DDf Innova technology will turn a chip shooter into a Flip Chip Shooter, a SMT machine into an Advanced Semiconductor Assembly solution, and a custom automation platform into a Flexible Semi-conductor Assembly solution.
Hover-Davis Direct Die Feeding is your application solution.
Compatible with all pick & place equipment as well as custom automation applications.
Download our Innova Series Feeder product brochure for offline review of product features and general technical specifications.
Instantly access and download additional product information, such as the Innova Series Feeder product guide and more.
