DDf Innova Direct Die Feeder



Compatible with most pick and place machines.


Target Applications
With this feeding technology, world class assembly solutions can be configured to support a wide variety of products, including:

  • Hybrid Circuits and Sensors
  • Multi-Chip Modules
  • Semiconductor Components, including SIP
  • RFID Tags
  • 3-D Assemblies
  • MEMS
  • Solar Cell Assemblies
The DDf Innova technology will turn a chip shooter into a Flip Chip Shooter, a SMT machine into an Advanced Semiconductor Assembly solution, and a custom automation platform into a Flexible Semi-conductor Assembly solution.

Hover-Davis Direct Die Feeding is your application solution.